326105 - TE Connectivity

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

326105
Manufacturer

TE Connectivity
ChipWorker Part#

CW39980066
Category

Solderless Terminal
Description

Ring Tongue Terminal 83.57mm 45.72mm Tin Box
Documentation

Datasheet

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326105 Specifications

Attribute	Attribute Value

Part Number	326105
Manufacturer	TE Connectivity
ChipWorker Part#	CW39980066
Category	Solderless Terminal
Documentation	Datasheet
Mounting Style	Lug
Contact Plating	Tin
Orientation	Straight
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Size-Length	83.57 mm
Size-Width	45.72 mm
Size-Thickness	5.08 mm
Contact Material	Copper
Material	Copper
Insulation Material	Non-Insulated
Operating Temperature	-40℃ ~ 105℃
Product Lifecycle Status	Active
Packaging	Box
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ELV Compliant	Compliant
HTS Code	8536904000
ECCN Code	EAR99

Product Description

TERMINAL,AMPOWER 500MCM 1/2
Product Highlights
Power Generation and Distribution Application
Wire Size (AWG/CM) = 500,000 CM
Wire Range = 450000 - 550000 CMA
Terminal Type = Standard
Stud Size = 1/2 [M12]

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Ordering Information

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These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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