74LCX16245MEA - Fairchild

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

74LCX16245MEA
Manufacturer

Fairchild
ChipWorker Part#

CW89913587
Category

Logic Controller, Logic IC
Package

SSOP-48
Description

IC TXRX BIRDIR 16Bit 5V 48SSOP
Documentation

Datasheet

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74LCX16245MEA Specifications

Attribute	Attribute Value

Part Number	74LCX16245MEA
Manufacturer	Fairchild
ChipWorker Part#	CW89913587
Category	Logic Controller, Logic IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	48 Pin
Case/Package	SSOP-48
Supply Voltage (DC)	2.50 V
Number of Bits	16 Bit
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	2V ~ 3.6V
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Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Obsolete
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	EAR99

Product Description

General Description
The LCX16245 contains sixteen non-inverting bidirectional buffers with 3-STATE outputs and is intended for bus ori ented applications. The device is designed for low voltage (2.5V or 3.3V) VCCapplications with capability of interfac ing to a 5V signal environment. The device is byte con
trolled. Each byte has separate control inputs which could be shorted together for full 16-bit operation. The T/Rinputs determine the direction of data flow through the device. The OEinputs disable both the A and B ports by placing them in a high impedance state. The LCX16245 is fabricated with an advanced CMOS tech nology to achieve high speed operation while maintaining CMOS low power dissipation.
Features
■5V tolerant inputs and outputs
■2.3V–3.6V VCCspecifications provided
■4.5 ns tPDmax (VCC 3.3V), 20 PA ICCmax
■Power down high impedance inputs and outputs
■Supports live insertion/withdrawal (Note 1)
■r24 mA output drive (VCC 3.0V)
■Uses patented noise/EMI reduction circuitry
■Latch-up performance exceeds 500 mA
■ESD performance: Human body model !2000V Machine model !200V
■Also packaged in plastic Fine-Pitch Ball Grid Array (FBGA)

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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