AM3517AZCN - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

AM3517AZCN
Manufacturer

TI
ChipWorker Part#

CW4400755
Category

Microprocessor IC
Package

LFBGA-491
Description

MPU AM35x RISC 32Bit 65nm 600MHz 1.8V/3.3V 491Pin NFBGA
Documentation

Datasheet

AM3517AZCN Global Supplier

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AM3517AZCN Specifications

Attribute	Attribute Value

Part Number	AM3517AZCN
Manufacturer	TI
ChipWorker Part#	CW4400755
Category	Microprocessor IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	491 Pin
Case/Package	LFBGA-491
Frequency	600 MHz
Supply Voltage (DC)	1.15V (min)
Clock Speed	600 MHz
RAM Memory Size	65536 B
Number of Bits	32 Bit
Number of UARTs	4 UART
Operating Temperature (Max)	90 ℃
Operating Temperature (Min)	0 ℃
Supply Voltage (Max)	1.248 V
Supply Voltage (Min)	1.152 V
	expand all
Operating Temperature	0℃ ~ 90℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
HK STC License	NLR

Product Description

1.1 Features
123456
• AM3517/05 Sitara™ ARM Microprocessor:
– MPU Subsystem
• 600-MHz Sitara™ ARM®Cortex™-A8 Core
• NEON SIMD Coprocessor and Vector
floating point (FP) co-processor
– Memory Interfaces:
• 166 MHz 16/32- bit mDDR/DDR2 Interface
with 1 GByte total addressable space
• Up to 83 MHz General Purpose Memory
Interface supporting 16-bit Wide
Multiplexed Address/Data bus
• 64 K-Byte SRAM
• 3 Removable Media Interfaces
[MMC/SD/SDIO]
– IO Voltage:
• mDDR/DDR2 IOs: 1.8V
• Other IOs: 1.8V and 3.3V
– Core Voltage: 1.2V
– Commercial and Extended Temperature Grade (operating restrictions apply)

expand all

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- Please check the technical specifications of the products when ordering.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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