AT24C08 - ATMEL

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

AT24C08
Manufacturer

ATMEL
ChipWorker Part#

CW41805675
Category

Active Chip
Package

DIP8
Description

8K, 2-Wire Bus Serial EEPROM
Documentation

Datasheet

AT24C08 Global Supplier

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AT24C08 Specifications

Attribute	Attribute Value

Part Number	AT24C08
Manufacturer	ATMEL
ChipWorker Part#	CW41805675
Category	Active Chip
Documentation	Datasheet
Case/Package	DIP8

Product Description

Description
The AT24C01A/02/04/08/16 provides 1024/2048/4096/8192/16384 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 128/256/512/1024/2048 words of 8 bits each. The device is optimized for use in many automotive applications where low-power and low-voltage operation are essential. The AT24C01A/02/04/08/16 is available in space-saving 8-lead PDIP and 8-lead JEDEC SOIC packages and is accessed via a two-wire serial interface. In addition, the entire family is available in 5.0V (4.5V to 5.5V) and 2.7V (2.7V to 5.5V) versions.
Features
• Medium-voltage and Standard-voltage Operation
– 5.0 (VCC = 4.5V to 5.5V)
– 2.7 (VCC = 2.7V to 5.5V)
• Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K), 1024 x 8 (8K) or 2048 x 8 (16K)
• Two-wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bi-directional Data Transfer Protocol
• 100 kHz (2.7V) and 400 kHz (5V) Compatibility
• Write Protect Pin for Hardware Data Protection
• 8-byte Page (1K, 2K), 16-byte Page (4K, 8K, 16K) Write Modes
• Partial Page Writes are Allowed
• Self-timed Write Cycle (5 ms max)
• High-reliability
– Endurance: 1 Million Write Cycles
– Data Retention: 100 Years
• 8-lead PDIP and 8-lead JEDEC SOIC Packages

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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