BGA524N6E6327XTSA1 - Infineon

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

BGA524N6E6327XTSA1
Manufacturer

Infineon
ChipWorker Part#

CW2574887
Category

Amplifier chip
Package

TSNP-6-2
Description

GPS Amp Single Low Noise 1.615GHz 3.3V 6Pin TSNP T/R
Documentation

Datasheet

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BGA524N6E6327XTSA1 Specifications

Attribute	Attribute Value

Part Number	BGA524N6E6327XTSA1
Manufacturer	Infineon
ChipWorker Part#	CW2574887
Category	Amplifier chip
Documentation	Datasheet
Number of Pins	6 Pin
Case/Package	TSNP-6-2
Frequency	1.55GHz ~ 1.615GHz
Operating Voltage	1.5V ~ 3.3V
Supply Current	2.5 mA
Number of Channels	1 Channel
Number of Positions	6 Position
Power Dissipation	60 mW
Gain	19.6 dB
Test Frequency	1.55GHz ~ 1.615GHz
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	60 mW
Supply Voltage	1.5V ~ 3.3V
Supply Voltage (Max)	3.3 V
Supply Voltage (Min)	1.5 V
	expand all
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	EAR99
HK STC License	NLR

Product Description

Summary of Features:
High insertion power gain: 19.6 dB
Out-of-band input 3rd order intercept point: -4dBm
Input 1 dB compression point: -12 dBm
Low noise figure: 0.55 dB
Very low current consumption: 2.5 mA
Operating frequencies: 1550 - 1615 MHz
Supply voltage: 1.5 V to 3.3 V
Digital on/off switch (1V logic high level)
Ultra small TSNP-6-2 leadless package (footprint: 0.7 x 1.1 mm2)
B7HF Silicon Germanium technology
RF output internally matched to 50 Ω
Only 1 external SMD component necessary
2kV HBM ESD protection (including AI-pin)
Pb-free (RoHS compliant) package
Target Applications:
Ideal for all Global Navigation Satellite Systems (GNSS) like GPS, GLONASS, Beidou, Galileo and others

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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