BGA715N7E6327XTSA2 - Infineon

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

BGA715N7E6327XTSA2
Manufacturer

Infineon
ChipWorker Part#

CW22723200
Category

Amplifier chip
Package

TSNP-7-1
Description

IC AMP GPS 3.3V 3.3mA TSLP7-1
Documentation

Datasheet

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BGA715N7E6327XTSA2 Specifications

Attribute	Attribute Value

Part Number	BGA715N7E6327XTSA2
Manufacturer	Infineon
ChipWorker Part#	CW22723200
Category	Amplifier chip
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	6 Pin
Case/Package	TSNP-7-1
Frequency	1.55GHz ~ 1.615GHz
Supply Current	3.3 mA
Number of Channels	1 Channel
Number of Positions	7 Position
Power Dissipation	36 mW
Gain	20 dB
Test Frequency	1.575 GHz
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	36 mW
Supply Voltage	1.5V ~ 3.3V
Supply Voltage (Max)	3.3 V
Supply Voltage (Min)	1.5 V
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Size-Length	2 mm
Size-Width	1.3 mm
Size-Height	0.35 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	EAR99

Product Description

Description:
The BGA715N7 is a front-end low noise amplifier for Global Navigation Satellite Systems (GNSS) from 1550 MHz to 1615 MHz like GPS, GLONASS, Beidou, Galileo and others. The LNA provides 20 dB gain, 0.7 dB noise figure and high linearity performance in the application configuration. Current consumption is as low as 3.3 mA. The BGA715N7 is based upon Infineon Technologies‘ B7HFM Silicon Germanium technology. It operates over a 1.5 V to 3.3 V supply range.
Summary of Features:
High gain: 20 dB
Low Noise Figure: 0.7 dB
Low current consumption: 3.3 mA
Supply voltage: 1.5 V to 3.3 V
High input compression point -15.5 dBm at 1.8 V supply
High input 3rd intercept point -7 dBm at 1.8 V supply
B7HFM Silicon Germanium technology
RF output internally matched to 50 Ω
Low external part count
2kV HBM ESD protection (including AI-pin)
TSNP-7-1/TSNP-7-2 leadless packages
Moisture sensitivity level: MSL 1
Pb-free (RoHS compliant) package

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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