BGA725L6E6327FTSA1 - Infineon

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

BGA725L6E6327FTSA1
Manufacturer

Infineon
ChipWorker Part#

CW1546963
Category

Amplifier chip
Package

TSLP-6-2
Description

INFINEON BGA725L6E6327FTSA1 RF AMP, 20dB, 1.615GHz, 3.6V, TSLP-6
Documentation

Datasheet

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BGA725L6E6327FTSA1 Specifications

Attribute	Attribute Value

Part Number	BGA725L6E6327FTSA1
Manufacturer	Infineon
ChipWorker Part#	CW1546963
Category	Amplifier chip
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	6 Pin
Case/Package	TSLP-6-2
Frequency	1.55GHz ~ 1.615GHz
Supply Voltage (DC)	1.50V (min)
Supply Current	3.6 mA
Number of Channels	1 Channel
Number of Positions	6 Position
Power Dissipation	72 mW
Gain	20 dB
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	72 mW
Supply Voltage	1.5V ~ 3.6V
Supply Voltage (Max)	3.6 V
Supply Voltage (Min)	1.5 V
	expand all
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

Description:
The BGA725L6 is a front-end low noise amplifier for Global Navigation Satellite Systems (GNSS) from 1550 MHz to 1615 MHz like GPS, GLONASS, Beidou, Galileo and others. The LNA provides 20.0 dB gain and 0.65 dB noise figure at a current consumption of 3.6 mA in the application configuration described. The BGA725L6 is based upon Infineon Technologies‘ B7HF Silicon Germanium technology. It operates from 1.5 V to 3.6 V supply voltage.
Summary of Features:
High insertion power gain: 20.0 dB
Out-of-band input 3rd order intercept point: -2 dBm
Input 1 dB compression point: -15 dBm
Low noise figure: 0.65 dB
Low current consumption: 3.6 mA
Operating frequencies: 1550 - 1615 MHz
Supply voltage: 1.5 V to 3.6 V
Digital on/off switch (1V logic high level)
Ultra small TSLP-6-2 leadless package (footprint: 0.7 x 1.1 mm2)
B7HF Silicon Germanium technology
RF output internally matched to 50 Ω
Only 1 external SMD component necessary
2kV HBM ESD protection (including AI-pin)
Pb-free (RoHS compliant) package

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Surface testing

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