BGA824N6E6327XTSA1 - Infineon

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

BGA824N6E6327XTSA1
Manufacturer

Infineon
ChipWorker Part#

CW2009325
Category

Amplifier chip
Package

TSNP-6-2
Description

Narrow Band Low Power, 1550MHz Min, 1615MHz Max, 1.10 X 0.7MM, ROHS COMPLIANT, LEADLESS, ULTRA SMALL, TSNP-6-2, 6Pin
Documentation

Datasheet

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BGA824N6E6327XTSA1 Specifications

Attribute	Attribute Value

Part Number	BGA824N6E6327XTSA1
Manufacturer	Infineon
ChipWorker Part#	CW2009325
Category	Amplifier chip
Documentation	Datasheet
Number of Pins	6 Pin
Case/Package	TSNP-6-2
Frequency	1.55GHz ~ 1.615GHz
Supply Current	3.8 mA
Number of Channels	1 Channel
Number of Positions	6 Position
Power Dissipation	60 mW
Gain	17 dB
Test Frequency	1.55GHz ~ 1.615GHz
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	60 mW
Supply Voltage	1.5V ~ 3.3V
Supply Voltage (Max)	3.3 V
Supply Voltage (Min)	1.5 V
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Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Unknown
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99
HK STC License	NLR

Product Description

Description:
The BGA824N6 is a front-end low noise amplifier for Global Navigation Satellite Systems (GNSS) from 1550 MHz to 1615 MHz like GPS, GLONASS, Beidou, Galileo and others. The LNA provides 17.0 dB gain and 0.55 dB noise figure at a current consumption of 3.8 mA in the application configuration described in Chapter 3 (see datasheet). The BGA824N6 is based upon Infineon Technologies‘ B7HF Silicon Germanium technology. It operates from 1.5 V to 3.6 V supply voltage.
Summary of Features:
High insertion power gain: 17.0 dB
Out-of-band input 3rd order intercept point: +7 dBm
Input 1 dB compression point: -6 dBm
Low noise figure: 0.55 dB
Low current consumption: 3.8 mA
Operating frequencies: 1550 - 1615 MHz
Supply voltage: 1.5 V to 3.3 V
Digital on/off switch (1V logic high level)
Ultra small TSNP-6-2 leadless package (footprint: 0.7 x 1.1 mm
B7HF Silicon Germanium technology
RF output internally matched to 50 Ω
Only 1 external SMD component necessary
2kV HBM ESD protection (including AI-pin)
Pb-free (RoHS compliant) package Application
Target Applications:
Ideal for all Global Navigation Satellite Systems (GNSS) like GPS, GLONASS, Beidou, Galileo and others.

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