BGU7258X ,Amplifier chip - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

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75 points

Part No

BGU7258X
Manufacturer

NXP
ChipWorker Part#

CW9082004
Category

Amplifier chip
Package

XFDFN-6
Description

RF Amp Single LNA 5.925GHz 3.6V 6Pin HXSON EP
Documentation

Datasheet
Ships from

Moscow
Наличие

In Stock
Estimated Price

$ 0.3

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BGU7258X Specifications

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Attribute	Attribute Value

Part Number	BGU7258X
Manufacturer	NXP
ChipWorker Part#	CW9082004
Category	Amplifier chip
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	6 Pin
Case/Package	XFDFN-6
Frequency	5GHz ~ 6GHz
Supply Current	13 mA
Number of Channels	1 Channel
Number of Positions	6 Position
Gain	13 dB
Test Frequency	5.9 GHz
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	3V ~ 3.6V
Supply Voltage (Max)	3.6 V
Supply Voltage (Min)	3 V
	expand all
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

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Product Description

Overview
The BGU7258 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 5 GHz to 6 GHz ISM band. Manufactured in NXP’s high performance SiGe:C technology, the BGU7258 couples best-in-class gain, noise figure, linearity and efficiency with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGU7258 features a robust temperature-compensated internal bias network and an integral bypass / shutdown feature that stabilizes the DC operating point over temperature and enables operation in the presence of high input signals, while minimizing current consumption in bypass (standby) mode. The 1.6 mm x 1.6 mm footprint coupled with only two external components, makes the circuit board implementation of the BGU7258 LNA the smallest IEEE 802.11ac LNA with bypass solution on the market, ideal for space sensitive applications.
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## Features
* Fully integrated, high performance LNA with built-in bypass
* Integrated DC blocking at RF input and RF output, with only two external components needed
* Low 1.6 dB noise figure with 13 mA current consumption
* Low bypass current of 1 μA (typical)
* Single supply 3.0 V to 3.6 V operation
* Integrated concurrent 2.4 GHz notch filter and temperature stabilized bias network
* High IP3i and low EVM
* High ESD protection of 2 kV (HBM) on all pins
* Small, 0.5 mm pitch, 1.6 mm x 1.6 mm x 0.5 mm QFN-style package, MSL 1 at 260 °C
* Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) following NXP’s RHF-2006 indicator D (dark green)
## Target Applications
* IEEE 802.11a/n/ac WiFi, WLAN
* Smartphones, tablets, netbooks and other portable computing devices
* Access points, routers, gateways
* Wireless video
* LTE advanced in unlicensed spectrum (LTE-U)
* General purpose ISM applications
## Features

expand all

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing