BGU8051X - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

BGU8051X
Manufacturer

NXP
ChipWorker Part#

CW25050721
Category

Amplifier chip
Package

WFDFN-8
Description

RF Amp Single LNA 1.5GHz 5.25V 8Pin HWSON EP T/R
Documentation

Datasheet

BGU8051X Global Supplier

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BGU8051X Specifications

Attribute	Attribute Value

Part Number	BGU8051X
Manufacturer	NXP
ChipWorker Part#	CW25050721
Category	Amplifier chip
Documentation	Datasheet
Number of Pins	8 Pin
Case/Package	WFDFN-8
Frequency	300MHz ~ 1.5GHz
Supply Current	48 mA
Number of Positions	8 Position
Power Dissipation	510 mW
Gain	18.3 dB
Test Frequency	900 MHz
Operating Temperature (Max)	150 ℃
Power Dissipation (Max)	510 mW
Supply Voltage	4.75V ~ 5.25V
Supply Voltage (Max)	5.25 V
Supply Voltage (Min)	3.3 V
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Size-Height	0.72 mm
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	5A991G

Product Description

* Low noise performance: NF = 0.43 dB * High linearity performance: IP3O = 39 dBm * High input return loss > 15 dB * High output return loss > 20 dB * Unconditionally stable * Programmable bias current (via resistor) * Small 8-terminal leadless package 2 mm x 2 mm x 0.75 mm * ESD protection on all terminals * Moisture sensitivity level 1 * Fast shutdown to support TDD systems * +5 V single supply

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These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
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- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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