BGU8052X - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

BGU8052X
Manufacturer

NXP
ChipWorker Part#

CW5583526
Category

Amplifier chip
Package

WFDFN-8
Description

RF Amp Single LNA 2.5GHz 5.25V 8Pin HWSON EP T/R
Documentation

Datasheet

BGU8052X Global Supplier

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BGU8052X Specifications

Attribute	Attribute Value

Part Number	BGU8052X
Manufacturer	NXP
ChipWorker Part#	CW5583526
Category	Amplifier chip
Documentation	Datasheet
Number of Pins	8 Pin
Case/Package	WFDFN-8
Frequency	1.5GHz ~ 2.5GHz
Supply Current	48 mA
Number of Channels	1 Channel
Number of Positions	8 Position
Power Dissipation	0.51 W
Output Power	18 dBm
Gain	18.5 dB
Test Frequency	1.9 GHz
Operating Temperature (Max)	150 ℃
Power Dissipation (Max)	510 mW
Supply Voltage	4.75V ~ 5.25V
Supply Voltage (Max)	5.25 V
Supply Voltage (Min)	3.3 V
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Size-Height	0.72 mm
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

Overview
The BGU8052 is, also known as the BGTS1001M, a low noise high linearity amplifier for wireless infrastructure applications, equipped with fast shutdown to support TDD systems. The LNA has a high input and output return loss and is designed to operate between 1.5 GHz and 2.5 GHz. It is housed in a 2 mm x 2 mm x 0.75 mm 8-terminal plastic thin small outline package. The LNA is ESD protected on all terminals.
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## Features
* Low noise performance: NF = 0.50 dB
* High linearity performance: IP3O = 36 dBm
* High input return loss > 15 dB
* High output return loss > 20 dB
* Unconditionally stable up to 20 GHz
* Programmable bias current (via resistor)
* Small 8-terminal leadless package 2 mm x 2 mm x 0.75 mm
* ESD protection on all terminals
* Moisture sensitivity level 1
* Fast shut down to support TDD systems
* 3 V to 5 V single supply
## Target Applications
* Wireless infrastructure
* Low noise and high linearity applications
* LTE, W-CDMA, CDMA, GSM
* General-purpose wireless applications
* TDD or FDD systems
* Suitable for small cells
## Features

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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