BTS6163DAUMA1 - Infineon

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

BTS6163DAUMA1
Manufacturer

Infineon
ChipWorker Part#

CW1757808
Category

Power Distribution
Package

TO-252
Description

Buffer/Inverter Based Peripheral Driver, 1 Driver, 5.5A, PSSO4, GREEN, PLASTIC, TO-252, DPAK-5
Documentation

Datasheet

BTS6163DAUMA1 Global Supplier

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BTS6163DAUMA1 Specifications

Attribute	Attribute Value

Part Number	BTS6163DAUMA1
Manufacturer	Infineon
ChipWorker Part#	CW1757808
Category	Power Distribution
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	5 Pin
Case/Package	TO-252
Number of Outputs	1 Output
Output Current	5.5 A
Number of Positions	5 Position
Power Dissipation	59 W
Output Current (Min)	5.5 A
Operating Temperature (Max)	150 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	59000 mW
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Size-Length	6.5 mm
Size-Width	6.22 mm
Size-Height	2.3 mm
Operating Temperature	-40℃ ~ 150℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	Compliant with Exemption
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

The BTS6163D is a 1-output high-side Power FET Switch with charge pump, current controlled input and diagnostic feedback with load current sense, integrated in smart SIPMOS® chip on chip technology. It provides embedded protective functions and optimized static electromagnetic compatibility.
Fast demagnetization of inductive loads
Electrostatic discharge (ESD) protection
High load current capability
High inrush current capability
High energy capability
Capable for 24V applications
Integrated diagnosis functionality
ESD sensitive device, take proper precaution while handling the device.

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Ordering Information

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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