BUL382 - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

BUL382
Manufacturer

ST Microelectronics
ChipWorker Part#

CW932899068
Description

TO-220 NPN 400V 5A
Documentation

Datasheet

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BUL382 Specifications

Attribute	Attribute Value

Part Number	BUL382
Manufacturer	ST Microelectronics
ChipWorker Part#	CW932899068
Documentation	Datasheet
Mounting Style	Through Hole
Case/Package	TO-220
Polarity	NPN
Breakdown Voltage (Collector to Emitter)	400 V
Continuous Collector Current	5A
	expand all
Product Lifecycle Status	Unknown

Product Description

DESCRIPTION
The BUL381 and BUL382 manufactured using high voltage Multiepitaxial Mesa technology for
cost-effective high performance. They use a Hollow Emitter structure to enhance switching
speeds. The BUL series is designed for use in lighting applications and low cost switch-mode power supplies.
■ STM PREFERRED SALESTYPES
■ HIGH VOLTAGE CAPABILITY
■ MINIMUM LOT-TO-LOT SPREAD FOR RELIABLE OPERATION
■ VERY HIGH SWITCHING SPEED
■ FULLY CHARACTERISED AT 125oC
APPLICATIONS
■ ELECTRONIC BALLASTS FOR FLUORESCENT LIGHTING
■ SWITCH MODE POWER SUPPLIES

expand all

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
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- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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