C0402C105M9PACTU - KEMET Corporation

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

C0402C105M9PACTU
Manufacturer

KEMET Corporation
ChipWorker Part#

CW42264637
Category

Ceramic Capacitor
Package

0402
Description

KEMET C0402C105M9PACTU SMD Multilayer Ceramic Capacitor, 0402 [1005 Metric], 1µF, 6.3V, ± 20%, X5R, C Series
Documentation

Datasheet

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C0402C105M9PACTU Specifications

Attribute	Attribute Value

Part Number	C0402C105M9PACTU
Manufacturer	KEMET Corporation
ChipWorker Part#	CW42264637
Category	Ceramic Capacitor
Documentation	Datasheet
Mounting Style	Surface Mount
Case/Package (SI)	1005
Case/Package	0402
Pin Pitch	0.3 mm
Voltage Rating (DC)	6.30 V
Insulation Resistance	100 MΩ
Capacitance	1 µF
Capacitance Tolerance	±20 %
Dielectric Characteristic	X5R
Breakdown Voltage (Collector to Emitter)	20 V
Gain	15dB ~ 23dB
hFE Min	90 @5mA, 10V
Input Power (Max)	150 mW
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-55 ℃
Voltage Rating	6.3 V
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Size-Length	1.00 mm
Size-Width	0.5 mm
Size-Height	0.5 mm
Dielectric Material	Ceramic
Operating Temperature	-55℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/06/15

Product Description

Ceramic chips consist of formulated ceramic dielectric materials which have been fabricated into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is then fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Kemet ceramic chip capacitors are offered in the five most popular temperature characteristics: C0G (NP0) ,X7R, X5R,Z5U & Y5V.

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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