DS26LS31CN - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

DS26LS31CN
Manufacturer

TI
ChipWorker Part#

CW48829336
Category

Interface IC, Interface Controller
Package

DIP-16
Description

Quad Transmitter RS-422 16Pin PDIP Tube
Documentation

Datasheet

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DS26LS31CN Specifications

Attribute	Attribute Value

Part Number	DS26LS31CN
Manufacturer	TI
ChipWorker Part#	CW48829336
Category	Interface IC, Interface Controller
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	16 Pin
Case/Package	DIP-16
Supply Voltage (DC)	4.75V (min)
Output Current	20.0 mA
Number of Positions	16 Position
Power Dissipation	1.48 W
Drivers Per Package	4
Output Voltage (Max)	2.5 V
Operating Temperature (Max)	70 ℃
Operating Temperature (Min)	0 ℃
Supply Voltage	4.5V ~ 5.5V
Supply Voltage (Max)	5.25 V
Supply Voltage (Min)	4.75 V
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Operating Temperature	0℃ ~ 70℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	Non-Compliant
Lead-Free Status	Contains Lead
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15

Product Description

The DS26LS31CN is a Quad High Speed Differential Line Driver, designed for digital data transmission over balanced lines. Meets all the requirements of EIA Standard RS-422 and Federal Standard 1020. It is designed to provide unipolar differential drive to twisted-pair or parallel-wire transmission lines. The circuit provides an enable and disable function common to all four drivers. It features TRI-STATE outputs and logically ANDed complementary outputs. The inputs are all LS compatible and are all one unit load.
2.0ns Typical output skew
10ns Typical input to output delay
Operation from single 5V supply
Outputs will not load line when VCC = 0V
Four line drivers in one package for maximum package density
Output short-circuit protection
Complementary outputs
Meets requirements of EIA standard RS-422
Pin compatible with AM26LS31
Device has limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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