ESDA25LY - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

ESDA25LY
Manufacturer

ST Microelectronics
ChipWorker Part#

CW4508258
Category

TVS Diode
Package

SOT-23-3
Description

DIODE, ESD, UNID. 300W, 1.2V, SOT-23; Power Dissipation Pd: 300W; Clamping Volt
Documentation

Datasheet

ESDA25LY Global Supplier

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ESDA25LY Specifications

Attribute	Attribute Value

Part Number	ESDA25LY
Manufacturer	ST Microelectronics
ChipWorker Part#	CW4508258
Category	TVS Diode
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	3 Pin
Case/Package	SOT-23-3
Operating Voltage	24 V
Capacitance	50 pF
Breakdown Voltage	25 V
Number of Circuits	2 Circuit
Number of Positions	3 Position
Power Dissipation	300 W
Clamping Voltage	43 V
Test Current	1 mA
Max Breakdown Voltage	30 V
Peak Pulse Power	300 W
Min Breakdown Voltage	25 V
Operating Temperature (Max)	150 ℃
Operating Temperature (Min)	-40 ℃
Junction Temperature	-40℃ ~ 150℃
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Size-Height	1.4 mm
Operating Temperature	-40℃ ~ 150℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

The ESDA25LY is an automotive dual Transil™ ESD Protection Array designed to protect 1 line or 2 lines against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. It can also be used as bidirectional suppressor by connecting only pin 1 and 2.
Dual unidirectional Transil functions
<20µA at V Maximum low leakage current (IR)
300W at 8/20µs Peak pulse power
High ESD protection level up to 25kV
High integration
Suitable for high density boards

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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