F28M35H52C1RFPS - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

F28M35H52C1RFPS
Manufacturer

TI
ChipWorker Part#

CW22572536
Category

Microcontroller, MCU IC
Package

HTQFP-144
Description

MCU 32Bit C28x/ARM Cortex M3 RISC 512KB Flash 1.2V/1.8V/3.3V 144Pin HTQFP EP Tray
Documentation

Datasheet

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F28M35H52C1RFPS Specifications

Attribute	Attribute Value

Part Number	F28M35H52C1RFPS
Manufacturer	TI
ChipWorker Part#	CW22572536
Category	Microcontroller, MCU IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	144 Pin
Case/Package	HTQFP-144
Frequency	100 MHz
Clock Speed	150 GHz
RAM Memory Size	136 KB
FLASH Memory Size	1048576 B
Number of UARTs	6 UART
Number of ADCs	2 ADC
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	1.32 V
Supply Voltage (Min)	1.14 V
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Operating Temperature	-40℃ ~ 125℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

Description
The Concerto™ family is a multi-core system-on-chip microcontroller with independent communication and real-time control subsystems. The F28M35x is the first series in the Concerto family.
The communications subsystem is based on the industry-standard 32-bit ARM®Cortex™-M3 CPU and features a wide variety of communication peripherals, including Ethernet 1588, USB OTG with PHY, CAN, UART, SSI, I2C, and an external interface.
The real-time control subsystem is based on TI’s industry-leading proprietary 32-bit C28x™ Floating-Point CPU and features the most flexible and high-precision control peripherals, including ePWMs with fault protection, and encoders and captures—all as implemented by TI’s C2000™ Piccolo™ and Delfino™ families. In addition, the C28-CPU has been enhanced with the addition of the Viterbi, Complex Math, CRC Unit (VCU) instruction accelerator that implements efficient Viterbi, Complex Arithmetic, 16-bit FFTs and CRC algorithms.
A high-speed analog subsystem and supplementary RAM memory is shared, along with on-chip voltage regulation and redundant clocking circuitry. Safety considerations also include Error Correction Code (ECC), Parity, and Code Secure Memory, as well as documentation to assist with system-level industrial safety certification.
Features
F28M35x ( Concerto™) MCUs
• Host Subsystem — ARM Cortex™-M3
– 100 MHz
– Embedded Memory
• Up to 512KB Flash (ECC)
• Up to 32KB RAM (ECC/Parity)
• Up to 64KB Shared RAM
• 2KB IPC Message RAM
– 5 Universal Asynchronous Receiver/Transmitters (UARTs)
– 4 Synchronous Serial Interfaces (SSIs)/Serial Peripheral Interface (SPI)
– 2 Inter-integrated Circuits (I2Cs)
– Universal Serial Bus On-the-Go (USB-OTB) + PHY
– 10/100 ENET 1588 MII
– 2 Controller Area Networks (CANs)
– 32-Channel Direct Memory Access (μDMA)
– Dual Security Zones (128-Bit Password per Zone)
– External Peripheral Interface (EPI)
– Micro Cyclic Redundancy Check (µCRC) Module
– 4 General-Purpose Timers
– 2 Watchdog Timer Modules
• Clocking
– On-chip Crystal Oscillator/External Clock Input
– Dynamic PLL Ratio Changes Supported
• 1.2-V Digital, 1.8-V Analog, 3.3-V I/O Design
• Interprocessor Communications (IPC)
– 32 Handshaking Channels
– 4 Channels Generate IPC Interrupts
– Can be Used to Coordinate Transfer of Data Through IPC Message RAMs
• Control Subsystem — TMS320C28x™ 32-Bit CPU
– 150 MHz
– Embedded Memory
• Up to 512KB Flash (ECC)
• Up to 36KB RAM (ECC/Parity)
• 2KB IPC Message RAM
– IEEE-754 Single-Precision Floating-Point Unit (FPU)
– Viterbi, Complex Math, CRC Unit (VCU)
– Serial Communications Interface (SCI)
– Serial Peripheral Interface (SPI)
– Inter-integrated Circuit (I2C)
– 6-Channel Direct Memory Access (DMA)
– 9 Enhanced Pulse Width Modulator (ePWM) Modules
• 18 Outputs (16 High-Resolution)
– 6 32-Bit Enhanced Capture (eCAP) Modules
– 3 32-Bit Enhanced Quadrature Encoder (eQEP) Modules
– Multi-Channel Buffered Serial Port (McBSP)
– One Security Zone (128-Bit Password)
– 3 32-Bit Timers
• Analog Subsystem
– Dual 12-Bit Analog-to-Digital Converters (ADCs)
– Up to 2.88 MSPS
– Up to 20 Channels
– 4 Sample-and-Hold (S/H) Circuits
– Up to 6 Comparators With 10-Bit Digital-to-Analog Converter (DAC)
– On-chip Temperature Sensor
• Up to 74 Individually Programmable, Multiplexed GPIO Pins
• Package
– 144-Pin RFP PowerPAD™ Thermally Enhanced Thin Quad Flatpack (HTQFP)

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- Vacuum packed
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