FS32V234CMN1VUB - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

FS32V234CMN1VUB
Manufacturer

NXP
ChipWorker Part#

CW83408400
Package

FBGA-621
Description

For Front and Surround View Camera, Machine Learning and Sensor Fusion applications
Documentation

Datasheet

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FS32V234CMN1VUB Specifications

Attribute	Attribute Value

Part Number	FS32V234CMN1VUB
Manufacturer	NXP
ChipWorker Part#	CW83408400
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	621 Pin
Case/Package	FBGA-621
Number of Positions	621 Position
Operating Temperature (Max)	105 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	1.95 V
	expand all
Product Lifecycle Status	Qualification
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

Overview
The S32V234 is our 2nd generation vision processor family designed to support computation intensive applications for image processing and offers an ISP, powerful 3D GPU, dual APEX-2 vision accelerators, security and supports SafeAssure™. S32V234 is suited for ADAS, NCAP front camera, object detection and recognition, surround view, machine learning and sensor fusion applications. S32V234 is engineered for automotive-grade reliability, functional safety and security measures to support vehicle and industrial automation.
S32V234 has a complete enablement platform supported by S32 Design Studio IDE for Vision which includes a compiler, debugger, Vision SDK, Linux BSP and graph tools.
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## Features
* Quad Arm® Cortex®-A53 cores running up to 1GHz, Plus M4 core up to 133 MHz
* Dual APEX-2 vision accelerator cores enabled by OpenCL™, APEX-CV and APEX graph tool
* Supports ISO 26262 functional safety up to ASIL-C, IEC 61508 and DO 178 applications
* 3D GPU (GC3000) with OpenCL 1.2 EP 2.0, OpenGL ES 3.0, OpenVG 1.1
* Hardware security encryption on CSE2
* Embedded image sensor processing (ISP) for HDR, color conversion, tone mapping, etc. enabled by ISP graph tool
* MIPI CSI2 and parallel image sensor interfaces
* 4 MB on chip system RAM with end to end ECC on all memories
* DRAM controller support for DDR3 / DDR3L / LPDDR2
* -40 to 125 °C (junction temperature) operation
* 621 FC-BGA 17 mm x 17 mm, 0.65 mm pitch
## Features

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
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- Anti-vibration foam
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