FS820R08A6P2B - Infineon

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

FS820R08A6P2B
Manufacturer

Infineon
ChipWorker Part#

CW194099538
Package

AG-HYBRIDD-1
Description

HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications. Find appropriate Automotive EiceDRIVER™.
Documentation

Datasheet

FS820R08A6P2B Global Supplier

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FS820R08A6P2B Specifications

Attribute	Attribute Value

Part Number	FS820R08A6P2B
Manufacturer	Infineon
ChipWorker Part#	CW194099538
Documentation	Datasheet
Number of Pins	33 Pin
Case/Package	AG-HYBRIDD-1
Operating Temperature (Max)	175 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	714000 mW
	expand all
Product Lifecycle Status	Active
RoHS	Compliant with Exemption
Lead-Free Status	Lead Free

Product Description

Summary of Features:
Blocking Voltage 750V
Low VCEsat
Low Switching Losses
Low QG and Cres
Low Inductive Design
Tvj op = 150°C
Short-time extended Operation Temperature T vj op = 175°C
Benefits:
Compact Design
Direct Cooled Base Plate
Guiding elements for PCB and cooles assembly
Integrated NTC temperature sensor
PressFIT Contact Technology
RoHS complient

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Delivery

DHLPrice

UPS

FedEx

TNT

EMS

OCS

SF EXPRESS

Chipworker Certification

Ordering Information

Order Payment Shipping Package Quality Assurance

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- Please check the technical specifications of the products when ordering.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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