FXLP34L6X - Fairchild

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

FXLP34L6X
Manufacturer

Fairchild
ChipWorker Part#

CW77551110
Category

Logic Controller, Logic IC
Package

MicroPak-6
Description

Buffer 1CH Non-Inverting CMOS 6Pin MicroPak T/R
Documentation

Datasheet

FXLP34L6X Global Supplier

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FXLP34L6X Specifications

Attribute	Attribute Value

Part Number	FXLP34L6X
Manufacturer	Fairchild
ChipWorker Part#	CW77551110
Category	Logic Controller, Logic IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	6 Pin
Case/Package	MicroPak-6
Number of Outputs	1 Output
Output Current	2.60 mA
Number of Circuits	1 Circuit
Number of Channels	1 Channel
Number of Bits	1 Bit
Power Dissipation	180 mW
Number of Inputs	1 Input
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	180 mW
Number of Output Channels	1 Channel
Supply Voltage	1V ~ 3.6V
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Size-Length	1.45 mm
Size-Width	1 mm
Size-Height	0.5 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	EAR99

Product Description

By driving the input to the transmission line this FXLP34L6X buffer and line driver by Fairchild Semiconductor will amplify any signal. This line driver has a minimum operating temperature of -40 °C and a maximum of 85 °C. Tape and reel packaging will encase the product during shipment, ensuring safe delivery and enabling quick mounting of components. This non-inverting device has a typical operating supply voltage of 1.8|2.5|3.3 V. Its minimum operating supply voltage of 1 V, while its maximum is 3.6 V. It has 1 channels per chip.

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- Please check the technical specifications of the products when ordering.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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