GL827 - Genesys Logic

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

GL827
Manufacturer

Genesys Logic
ChipWorker Part#

CW750584166
Description

USB 2.0 Single Slot SD/MMC/MS/SM/xD-Picture Card Reader Controller
Documentation

Datasheet

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Product Description

GENERAL DESCRIPTION
The GL827 is USB 2.0 Single Interface Flash Card Reader controller. It supports USB 2.0 high-speed transmission to Secure DigitalTM (SD), SDHC, Mini SDTM , Micro SDTM , T-Flash, MultiMediaCardTM (MMC), RS MultiMediaCardTM (RS MMC), MMC Micro , HS-MMC, MMC-Mobile , Memory StickTM (MS), Memory Stick DuoTM (MS Duo), High Speed Memory Stick
TM (HS MS), Memory Stick PROTM (MS PRO), Memory Stick PROTM Duo (MS PRO Duo), Memory Stick ROM, MS PRO Micro, SmartMediaTM (SM) , and xD-Picture Card TM
(xD) on one chip. As a single chip solution for USB 2.0 flash card reader, the GL827
complies with Universal Serial Bus specification rev. 2.0, USB Storage Class specification ver.1.0, and flash card interface specification each.
The GL827 can support different kinds of interfacesin single slot. For the best performance consideration, the GL827 integrates high efficiency card interface hardware engine for data transfer. The GL827 also supports firmware upgrade via USB interface (100 Pin LQFP), and external flash read/ write for firmware upgrade and other applications.
The GL827 pin assignment design fits to card sockets to provide easier PCB layout. 100 Pin LQFP (14mmx14mm), 48 Pin LQFP/LQFN (7mm x 7mm), QFN24 (4mm x 4mm), SSOP28 (150mil) are available package types.
FEATURES
USB specification compliance
- Comply with 480Mbps Universal Serial Bus specification rev. 2.0.
- Comply with USB Storage Class specification rev. 1.0.
- Support 1 device address and up to 4 endpoints: Control (0)/ Bulk Read (1)/ Bulk Write (2)/Interrupt (3).
Integrated USB building blocks
- USB2.0 transceiver macro (UTM), Serial Interface Engine (SIE), Build-in power-on reset (POR) and
low-voltage detector (LVD)
Embedded 8051 micro-controller
- Operate @ 60 MHz clock, 12 clocks per instruction cycle
- Embedded 48K Byte mask ROM and internal 256 byte SRAM
- Embedded 4K Byte external SRAM
- Support up to external 48K code ROM
Supports firmware upgrade to external flash via USB( ISP : In System Programming ) (Only for
LQFP100)
USB 2.0 certified (USB-IF Pass, TID: 40000207/ 40550012)
WHQL submission number 1062005.
Vista submission number 1218426.
xD-Picture (Only for LQFP100/ LQFP48/ LQFN48)
- xD-Picture specification v1.2C. Type-M / Type-H
SmartMediaTM (Only for LQFP100/ LQFP48/ LQFN48)
- 8 bit data width and different speed
- Support different page size, and automatic append redundant area data (8 / 16 bytes)
Memory StickTM/ Memory Stick PRO / Memory Stick PRO Duo / MemoryStick Micro (For all packages)
- Comply with Memory Stick specification
- Support INS signal
- Support automatic CRC16 generation and verification Secure DigitalTM and MultiMediaCardTM
(For all packages)
- Supports SD specification v1.0 / v1.1 / v2.0
- Supports MMC specification v3.X / v4.0 / v4.1 / v4.2.
- x1 / x4 / x8 data transmission. (For QFN24 and CSP23 up to x4)
- Automatic CRC7 generation for command and CRC7 verification for response on CMD
- Support automatic CRC16 generation and verificationon DAT0:7
- In addition to full packet transaction, optional single byte / bit operation on both CMD and DAT line / lines
- Process data in block or byte
On board 12 MHz Crystal driver circuit or 12/48 MHzClock input.
On-Chip 5V to 3.3V regulator. No external regulatorrequired.
On-Chip power MOSFETs for supplying flash media card power.
Available in 100 Pin LQFP (14x14 mm) package
Available in 48 Pin LQFP/LQFN (7x7 mm) package
Available in 24 Pin QFN (4x4 mm) package
Available in 28 Pin SSOP (150mil) package
Order in Advance in 23 Pin CSP (2x2 mm) package

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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