HD64F2357F20 - Renesas Electronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HD64F2357F20
Manufacturer

Renesas Electronics
ChipWorker Part#

CW160445977
Category

Microcontroller, MCU IC
Package

QFP
Description

MCU 16Bit H8S CISC 128KB Flash 5V 128Pin PQFP
Documentation

Datasheet

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HD64F2357F20 Specifications

Attribute	Attribute Value

Part Number	HD64F2357F20
Manufacturer	Renesas Electronics
ChipWorker Part#	CW160445977
Category	Microcontroller, MCU IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	128 Pin
Case/Package	QFP
Supply Voltage (DC)	5.00 V, 5.50 V (max)
Clock Speed	20.0 MHz, 20.0 MHz (max)
RAM Memory Size	8 KB
Number of I/O Pins	87 IO
Access Time	20.0 µs
Number of ADCs	1 ADC
Operating Temperature (Max)	75 ℃
Operating Temperature (Min)	-20 ℃
Number of DACs	1 DAC
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Product Lifecycle Status	Unknown
Packaging	Bulk
RoHS	Non-Compliant
Lead-Free Status	Contains Lead

Product Description

Overview
The H8S/2357 Group is a series of microcomputers (MCUs: microcomputer units), built around the H8S/2000 CPU, employing Renesas proprietary architecture, and equipped with peripheral functions on-chip.
The H8S/2000 CPU has an internal 32-bit architecture, is provided with sixteen 16-bit general registers and a concise, optimized instruction set designed for high-speed operation, and can address a 16-Mbyte linear address space. The instruction set is upward-compatible with H8/300 and H8/300H CPU instructions at the object-code level, facilitating migration from the H8/300, H8/300L, or H8/300H Series.
On-chip peripheral functions required for system configuration include DMA controller (DMAC) and data transfer controller (DTC) bus masters, ROM and RAM memory, a 16-bit timer-pulse unit (TPU), programmable pulse generator (PPG), 8-bit timer, watchdog timer (WDT), serial communication interface (SCI), A/D converter, D/A converter, and I/O ports.
Single-power-supply flash memory (F-ZTAT1), PROM (ZTAT*2), and masked ROM versions are available, providing a quick and flexible response to conditions from ramp-up through full-scale volume production, even for applications with frequently changing specifications.

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