HIP2100 - Intersil

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HIP2100
Manufacturer

Intersil
ChipWorker Part#

CW564033159
RoHS

Lead free / RoHS Compliant
Description

100V/2A Peak High-frequency Half Bridge Driver With Cmos Logic Inputs
Documentation

Datasheet

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HIP2100 Specifications

Attribute	Attribute Value

Part Number	HIP2100
Manufacturer	Intersil
ChipWorker Part#	CW564033159
Documentation	Datasheet
	expand all
RoHS	RoHS Compliant

Product Description

The HIP2100 is a high frequency, 100V Half Bridge N-Channel power MOSFET driver IC. The low-side and high-side gate drivers are independently controlled and matched to 8ns. This gives the user maximum flexibility in dead-time selection and driver protocol. Undervoltage protection on both the low-side and high-side supplies force the outputs low. An on-chip diode eliminates the discrete diode required with other driver ICs. A new level-shifter topology yields the low-power benefits of pulsed operation with the safety of DC operation. Unlike some competitors, the high-side output returns to its correct state after a momentary undervoltage of the high-side supply.
Features
• Drives N-Channel MOSFET Half Bridge
• SOIC, EPSOIC, QFN and DFN Package Options
• SOIC, EPSOIC and DFN Packages Compliant with 100V Conductor Spacing Guidelines of IPC-2221
• Pb-Free Product Available (RoHS Compliant)
• Bootstrap Supply Max Voltage to 114VDC
• On-Chip 1ΩBootstrap Diode
• Fast Propagation Times for Multi-MHz Circuits
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns
• CMOS Input Thresholds for Improved Noise Immunity
• Independent Inputs for Non-Half Bridge Topologies
• No Start-Up Problems
• Outputs Unaffected by Supply Glitches, HS Ringing Below Ground, or HS Slewing at High dv/dt
• Low Power Consumption
• Wide Supply Range
• Supply Undervoltage Protection
•3ΩDriver Output Resistance
• QFN/DFN Package:
\- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline
\- Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile
Applications
• Telecom Half Bridge Power Supplies
• Avionics DC-DC Converters
• Two-Switch Forward Converters
• Active Clamp Forward Converters

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Ordering Information

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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