HMC464 - ADI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HMC464
Manufacturer

ADI
ChipWorker Part#

CW1482866
Category

Amplifier chip
Package

Die
Description

ANALOG DEVICES HMC464 RF Amplifier IC, 14dB Gain / 6dB Noise, 2GHz to 20GHz, 7.5V to 8.5V, Gel Pack
Documentation

Datasheet

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HMC464 Specifications

Attribute	Attribute Value

Part Number	HMC464
Manufacturer	ADI
ChipWorker Part#	CW1482866
Category	Amplifier chip
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	4 Pin
Case/Package	Die
Frequency	2GHz ~ 20GHz
Supply Voltage (DC)	7.50V (min)
Supply Current	290 mA
Number of Channels	1 Channel
Power Dissipation	4640 mW
Gain	14 dB
Test Frequency	2GHz ~ 20GHz
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	4640 mW
Supply Voltage	8 V
Supply Voltage (Max)	8.5 V
Supply Voltage (Min)	7.5 V
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Operating Temperature	-55℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Contains Lead
REACH SVHC Compliance Edition	2015/12/17

Product Description

Product Details
The HMC464 is a GaAs MMIC PHEMT Distributed Power Amplifier die which operates between 2 and 20 GHz. The amplifier provides 16 dB of gain, +30 dBm Output IP3 and +26 dBm of output power at 1 dB gain compression while requiring 290 mA from a +8V supply. Gain flatness is excellent from 2 - 18 GHz making the HMC464 ideal for EW, ECM and radar driver amplifier applications. The HMC464 amplifier I/O’s are internally matched to 50 Ohms facilitating easy integration into Multi-Chip-Modules (MCMs). All data is with the chip in a 50 Ohm test fixture connected via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils).
**Applications**
Telecom Infrastructure
Microwave Radio & VSAT
Military & Space
Test Instrumentation
Fiber Optics
### Features and Benefits
P1dB Output Power: +26 dBm
Gain: 16 dB
Output IP3: +30 dBm
Supply Voltage: +8V @ 290 mA
50 Ohm Matched Input/Output
Die Size: 3.12 x 1.63 x 0.1 mm

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Surface testing

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