HMC487LP5E - ADI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HMC487LP5E
Manufacturer

ADI
ChipWorker Part#

CW3059200
Category

Amplifier chip
Package

QFN-32
Description

ANALOG DEVICES HMC487LP5E RF Amplifier IC, 22dB Gain / 8dB Noise, 9GHz to 12GHz, 6.5V to 7.5V, QFN-32
Documentation

Datasheet

HMC487LP5E Global Supplier

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HMC487LP5E Specifications

Attribute	Attribute Value

Part Number	HMC487LP5E
Manufacturer	ADI
ChipWorker Part#	CW3059200
Category	Amplifier chip
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	32 Pin
Case/Package	QFN-32
Frequency	9GHz ~ 12GHz
Supply Voltage (DC)	6.50V (min)
Supply Current	1.3 A
Number of Channels	1 Channel
Number of Positions	32 Position
Power Dissipation	10 W
Gain	22 dB
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	10000 mW
Supply Voltage	6.5V ~ 7.5V
Supply Voltage (Max)	7.5 V
Supply Voltage (Min)	6.5 V
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Size-Height	0.95 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Each
RoHS	RoHS Compliant
Lead-Free Status	Contains Lead
REACH SVHC Compliance Edition	2015/12/17

Product Description

Product Details
The HMC487LP5E is a high dynamic range GaAs PHEMT MMIC 2 Watt Power Amplifiers housed in leadless 5 x 5 mm surface mount packages. Operating from 9 to 12 GHz, the amplifier provides 20 dB of gain, +33 dBm of saturated power and 20% PAE from a +7V supply voltage. Output IP3 is +36 dBm typical. The RF I/Os are DC blocked and matched to 50 Ohms for ease of use. The HMC487LP5E eliminates the need for wire bonding, allowing use of surface mount manufacturing techniques.
**Applications**
Point-to-Point Radios
Point-to-Multi-Point Radios
Test Equipment and Sensors
Military End-Use
### Features and Benefits
Saturated Power: +33 dBm @ 20% PAE
Output IP3: +36 dBm
Gain: 20 dB
+7V @ 1300 mA Supply
50 Ω Matched Input/Output
25 mm2 Leadless SMT Package

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
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- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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