HMC609 - ADI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HMC609
Manufacturer

ADI
ChipWorker Part#

CW86024404
Category

Amplifier chip
Package

DIE
Description

RF Amp Single LNA 4GHz 7V 10Pin Die Tray
Documentation

Datasheet

HMC609 Global Supplier

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HMC609 Specifications

Attribute	Attribute Value

Part Number	HMC609
Manufacturer	ADI
ChipWorker Part#	CW86024404
Category	Amplifier chip
Documentation	Datasheet
Number of Pins	10 Pin
Case/Package	DIE
Frequency	2GHz ~ 4GHz
Supply Current	170 mA
Power Dissipation	1640 mW
Gain	20.5 dB
Test Frequency	2GHz ~ 4GHz
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	1640 mW
Supply Voltage	6 V
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Product Lifecycle Status	Active
Packaging	Bulk
RoHS	RoHS Compliant
Lead-Free Status	Contains Lead

Product Description

Product Details
The HMC609 is a GaAs PHEMT MMIC Low Noise Amplifier (LNA) chip which operates from 2 to 4 GHz. The HMC609 features extremely flat performance characteristics including 20dB of small signal gain, 3dB of noise figure and output IP3 of +36 dBm across the operating band. The versatile LNA is ideal for hybrid and MCM assemblies due to its compact size, consistent output power and DC blocked RF I/O"s. All data is measured with the chip in a 50 Ohm test fixture connected via one 0.025 mm (1 mil) diameter bondwire of minimal length 0.31 mm (12 mil).
**Applications**
Fixed Microwave
Point-to-Multi-Point Radios
Test & Measurement Equipment
Radar & Sensors
Military & Space
### Features and Benefits
Gain Flatness: 0.2 dB
Output IP3: +36 dBm
Gain: 20.5 dB
Output P1dB: +22 dBm
50 Ohm Matched Input/Output
Die Size: 2.11 x 1.32 x 0.10 mm

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- Please check the technical specifications of the products when ordering.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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