HMC716LP3E - ADI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HMC716LP3E
Manufacturer

ADI
ChipWorker Part#

CW33731461
Category

Amplifier chip
RoHS

Lead free / RoHS Compliant
Description

RF Amplifier IC, 18dB Gain / 1dB Noise, 3.1GHz to 3.9GHz, 5V supply, HVQFN-16
Documentation

Datasheet

HMC716LP3E Global Supplier

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HMC716LP3E Specifications

Attribute	Attribute Value

Part Number	HMC716LP3E
Manufacturer	ADI
ChipWorker Part#	CW33731461
Category	Amplifier chip
Documentation	Datasheet
Number of Pins	16 Pin
Case/Package	QFN-16
Frequency	3.1GHz ~ 3.9GHz
Supply Voltage (DC)	5.00V (max)
Power Rating	0.72 W
Supply Current	65 mA
Number of Channels	1 Channel
Number of Positions	16 Position
Power Dissipation	0.72 W
Gain	18 dB
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	720 mW
Supply Voltage	3V, 5V
Supply Voltage (Max)	5 V
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Size-Height	0.95 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	End of Life
Packaging	Cut Tape (CT)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2017/07/07

Product Description

RF Amplifier IC General Purpose 3.1GHz ~ 3.9GHz 16-QFN (3x3)

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Ordering Information

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These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
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- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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