HMC906 - ADI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

HMC906
Manufacturer

ADI
ChipWorker Part#

CW48704327
Category

Amplifier chip
Package

Die
Description

RF Amp Single Power Amp 33.5GHz 7V 9Pin Die Tray
Documentation

Datasheet

HMC906 Global Supplier

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HMC906 Specifications

Attribute	Attribute Value

Part Number	HMC906
Manufacturer	ADI
ChipWorker Part#	CW48704327
Category	Amplifier chip
Documentation	Datasheet
Number of Pins	9 Pin
Case/Package	Die
Power Dissipation	8800 mW
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	8800 mW
	expand all
Product Lifecycle Status	End of Life
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Contains Lead

Product Description

Look no further than the power amplifier HMC906 buffer amplifier from Analog Devices, a component that is designed to get the most out of an RF signal. Its maximum power dissipation is 8800 mW. This RF amplifier chip has a temperature range of -55 °C to 85 °C. This component comes in tray packaging, useful for fast picking and placing of your parts. This device uses a single power supply. It has a single channel per chip.

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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