INA333SHKJ - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

INA333SHKJ
Manufacturer

TI
ChipWorker Part#

CW77438136
Category

Amplifier, Buffer IC
Package

CFP-8
Description

SP Amp INSTR Amp Single R-R O/P ‚±2.75V/5.5V 8Pin CFPAK Tube
Documentation

Datasheet

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INA333SHKJ Specifications

Attribute	Attribute Value

Part Number	INA333SHKJ
Manufacturer	TI
ChipWorker Part#	CW77438136
Category	Amplifier, Buffer IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	8 Pin
Case/Package	CFP-8
Supply Current	50 µA
Number of Circuits	1 Circuit
Number of Channels	1 Channel
Common Mode Rejection Ratio	100 dB
Quiescent Current	198 µA
Bandwidth	3 kHz
Input Offset Voltage	10 µV
Input Bias Current	70 pA
Operating Temperature (Max)	210 ℃
Operating Temperature (Min)	-55 ℃
3dB Bandwidth	150 kHz
Gain Bandwidth	80 dB
Minimum CMRR Range	80 dB
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	1.8 V
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Operating Temperature	-55℃ ~ 210℃
Product Lifecycle Status	Active
Packaging	Tube
RoHS	Non-Compliant
Lead-Free Status	Contains Lead

Product Description

* LOW OFFSET VOLTAGE: 25µV (max), G ≥ 100 * LOW DRIFT: 0.1µV/°C, G ≥ 100 * LOW NOISE: 50nV/√Hz, G ≥ 100 * HIGH CMRR: 100dB (min), G ≥ 10 * LOW INPUT BIAS CURRENT: 200pA(max) * SUPPLY RANGE: +1.8V to +5.5V * INPUT VOLTAGE: (V-) +0.1V to (V+) -0.1V * OUTPUT RANGE: (V-) +0.05V to (V+) -0.05V * LOW QUIESCENT CURRENT: 50µA * OPERATING TEMPERATURE: -40°C to +125°C * RFI FILTERED INPUTS * MSOP-8 AND DFN-8 PACKAGES

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These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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