IRF630NSPBF - Infineon
The pictures are for reference only, and the specific specifications can be found in the product manual.
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Part NoIRF630NSPBF
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ManufacturerInfineon
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ChipWorker Part#CW12605545
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CategoryMOSFET, MOSFET Transistor
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PackageTO-263-3
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DescriptionD2PAK N-CH 200V 9.3A
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DocumentationDatasheet
Payment Methods and Delivery
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IRF630NSPBF Global Supplier
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IRF630NSPBF Specifications
| Attribute | Attribute Value |
|---|---|
| Part Number | IRF630NSPBF |
| Manufacturer | Infineon |
| ChipWorker Part# | CW12605545 |
| Category | MOSFET, MOSFET Transistor |
| Documentation | Datasheet |
| Mounting Style | Surface Mount |
| Number of Pins | 3 Pin |
| Case/Package | TO-263-3 |
| Power Rating | 82 W |
| Number of Positions | 3 Position |
| Drain to Source Resistance (on) (Rds) | 0.3 Ω |
| Polarity | N-Channel |
| Power Dissipation | 82 W |
| Threshold Voltage | 4 V |
| Drain to Source Voltage (Vds) | 200 V |
| Continuous Drain Current (Ids) | 9.3A |
| Rise Time | 14 ns |
| Input Capacitance (Ciss) | 575pF @25V(Vds) |
| Fall Time | 15 ns |
| Operating Temperature (Max) | 175 ℃ |
| Operating Temperature (Min) | -55 ℃ |
| Power Dissipation (Max) | 82W (Tc) |
| expand all | |
| Size-Length | 10.67 mm |
| Size-Width | 9.65 mm |
| Size-Height | 4.83 mm |
| Material | Silicon |
| Operating Temperature | -55℃ ~ 175℃ (TJ) |
| Product Lifecycle Status | Not Recommended for New Designs |
| Packaging | Rail, Tube |
| RoHS | Compliant with Exemption |
| Lead-Free Status | Lead Free |
| REACH SVHC Compliance Edition | 2015/12/17 |
Product Description
- The IRF630NSPBF is a HEXFET® fifth generation single N-channel Power MOSFET utilizes advanced processing techniques to achieve extremely low ON-resistance per silicon area. This benefit combined with the fast switching speed and ruggedized device design, provides an extremely efficient and reliable operation. The surface-mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible ON-resistance in any existing surface-mount package. It is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2W in a typical surface-mount application.
- Advanced process technology
- Dynamic dV/dt rating
- Fully avalanche rating
- Ease of paralleling
- Simple drive requirements
Delivery
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Ordering Information
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
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- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more > - - Carefully tested and packaged by ChipWorker- Vacuum packed - Anti-static packaging - Anti-vibration foam
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- Electrical testing
- Surface testing
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