ISO7761FDW - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

ISO7761FDW
Manufacturer

TI
ChipWorker Part#

CW38973431
Package

SOIC-16
Description

ISO7761FDW/R DIG ISO - MYNA - 6C
Documentation

Datasheet

ISO7761FDW Global Supplier

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ISO7761FDW Specifications

Attribute	Attribute Value

Part Number	ISO7761FDW
Manufacturer	TI
ChipWorker Part#	CW38973431
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	16 Pin
Case/Package	SOIC-16
Rise/Fall Time	1.1ns, 1.4ns
Number of Channels	6 Channel
Number of Positions	16 Position
Power Dissipation	292 mW
Isolation Voltage	5000 Vrms
Fall Time (Max)	3.9 ns
Fall Time (Max)	3.9 ns
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	292 mW
Supply Voltage	2.5V ~ 5.5V
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	2.25 V
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Operating Temperature	-55℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status

Product Description

General Purpose Digital Isolator 5000Vrms 6 Channel 100Mbps 85kV/µs CMTI 16-SOIC (0.295", 7.50mm Width)

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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