LM358MX - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

LM358MX
Manufacturer

TI
ChipWorker Part#

CW8766415
Category

Operational Amplifier, OP Amp IC
Package

SOIC-8
Description

Op Amp Dual GP ±16V/32V 8Pin SOIC T/R
Documentation

Datasheet

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LM358MX Specifications

Attribute	Attribute Value

Part Number	LM358MX
Manufacturer	TI
ChipWorker Part#	CW8766415
Category	Operational Amplifier, OP Amp IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	8 Pin
Case/Package	SOIC-8
Output Current	40mA @15V
Supply Current	800 µA
Number of Circuits	2 Circuit
Number of Channels	2 Channel
Power Dissipation	0.53 W
Common Mode Rejection Ratio	65 dB
Input Offset Drift	7.00 µV/K
Slew Rate	100 mV/μs
Gain Bandwidth Product	1 MHz
Input Offset Voltage	2.9 mV
Input Bias Current	45 nA
Operating Temperature (Max)	70 ℃
Operating Temperature (Min)	0 ℃
Gain Bandwidth	1 MHz
Power Dissipation (Max)	530 mW
Minimum CMRR Range	65 dB
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Operating Temperature	0℃ ~ 70℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	Non-Compliant
Lead-Free Status	Contains Lead

Product Description

**Description**
The LM158 series consists of two independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single power supply over a wide range of voltages. Operation from split power supplies is also possible and the low power supply current drain is independent of the magnitude of the power supply voltage.
Application areas include transducer amplifiers, dc gain blocks and all the conventional op-amp circuits which now can be more easily implemented in single power supply systems. For example, the LM158 series can be directly operated off of the standard 3.3-V power supply voltage which is used in digital systems and will easily provide the required interface electronics without requiring the additional ±15V power supplies. The LM358 and LM2904 are available in a chip sized package (8-Bump DSBGA) using TI"s DSBGA package technology.

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