LMK00334RTVR - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

LMK00334RTVR
Manufacturer

TI
ChipWorker Part#

CW2414963
Category

Clock Chip, Timing IC
Package

WFQFN-32
Description

Clock Multiplexer 8Out 3IN 1:8 32Pin WQFN EP T/R
Documentation

Datasheet

LMK00334RTVR Global Supplier

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LMK00334RTVR Specifications

Attribute	Attribute Value

Part Number	LMK00334RTVR
Manufacturer	TI
ChipWorker Part#	CW2414963
Category	Clock Chip, Timing IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	32 Pin
Case/Package	WFQFN-32
Frequency	400 MHz
Supply Voltage (DC)	3.30 V
Number of Outputs	4 Output
Supply Current	8.50 mA
Number of Circuits	1 Circuit
Number of Positions	32 Position
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	3.15V ~ 3.45V
Supply Voltage (Max)	3.45 V
Supply Voltage (Min)	3.15 V
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Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Cut Tape (CT)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	EAR99

Product Description

The LMK00334RTVR is a 4-output HCSL Fan-out Buffer intended for high-frequency, low-jitter clock/data distribution and level translation. The input clock can be selected from two universal inputs or one crystal input. The selected input clock is distributed to two banks of 2 HCSL outputs and one LVCMOS output. The LVCMOS output has a synchronous enable input for runt-pulse-free operation when enabled or disabled. The LMK00334 operates from a 3.3V core supply and 3 independent 3.3/2.5V output supplies. It provides high performance, versatility and power efficiency, making it ideal for replacing fixed-output buffer devices while increasing timing margin in the system.
3:1 Input multiplexer
Banks with 2 differential outputs each
LVCMOS Output with synchronous enable input
Pin-controlled configuration
Green product and no Sb/Br
Device has limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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