M29F160FB5AN6E2 - Micron

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

M29F160FB5AN6E2
Manufacturer

Micron
ChipWorker Part#

CW101124342
Category

Memory Chip
Package

TSOP-48
Description

NOR Flash Parallel 5V 16M-bit 2M x 8/1M x 16 55ns Automotive 48Pin TSOP Tray
Documentation

Datasheet

M29F160FB5AN6E2 Global Supplier

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M29F160FB5AN6E2 Specifications

Attribute	Attribute Value

Part Number	M29F160FB5AN6E2
Manufacturer	Micron
ChipWorker Part#	CW101124342
Category	Memory Chip
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	48 Pin
Case/Package	TSOP-48
Supply Current	20 mA
Number of Bits	8, 16 Bit
Access Time	55 ns
Access Time(Max)	55 ns
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	4.5V ~ 5.5V
	expand all
Size-Height	1 mm
Operating Temperature	-40℃ ~ 85℃ (TA)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status

Product Description

FLASH - NOR Memory IC 16Mb (2M x 8, 1M x 16) Parallel 55ns 48-TSOP

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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