MAX3232CDR - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

MAX3232CDR
Manufacturer

TI
ChipWorker Part#

CW80704
Category

Interface IC, Interface Controller
Package

SOIC-16
Description

RS232 Transceiver IC, 2 Drivers, 250Kbps, 3V to 5.5V, SOIC-16
Documentation

Datasheet

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MAX3232CDR Specifications

Attribute	Attribute Value

Part Number	MAX3232CDR
Manufacturer	TI
ChipWorker Part#	CW80704
Category	Interface IC, Interface Controller
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	16 Pin
Case/Package	SOIC-16
Supply Voltage (DC)	3.30 V, 5.00 V
Output Voltage	5.40 V
Supply Current	1 mA
Number of Positions	16 Position
Data Rate	250 kbps
Drivers Per Package	2
Operating Temperature (Max)	70 ℃
Operating Temperature (Min)	0 ℃
Supply Voltage	3V ~ 5.5V
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	3 V
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Size-Length	9.9 mm
Size-Width	3.91 mm
Size-Height	1.58 mm
Operating Temperature	0℃ ~ 70℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2014/12/17
ECCN Code	EAR99

Product Description

The MAX3232CDR is a Multichannel RS-232 Line Driver/Receiver with ±15kV ESD protection. This device consists of two line drivers, two line receivers and a dual charge-pump circuit with ±15kV ESD protection terminal to terminal (serial-port connection terminals, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3 to 5.5V supply. The devices operate at data signalling rates up to 250kbps and a maximum of 30V/µs driver output slew rate.
Two drivers and two receivers
300µA Typical low supply current
4 x 0.1µF External capacitors
Alternative high-speed terminal-compatible devices
Green product and no Sb/Br
This device has limited built-in ESD protection, leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

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