MC33274 - Multicomp

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

MC33274
Manufacturer

Multicomp
ChipWorker Part#

CW47471577
Category

Heatsinks, Heat Sink
Package

TO-218
Description

MULTICOMP MC33274 Heat Sink, TO-218/220/247W Clip, TO-218, TO-220, TO-247, 5.9℃/W, 50mm, 35mm, 25.6mm
Documentation

Datasheet

MC33274 Global Supplier

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MC33274 Specifications

Attribute	Attribute Value

Part Number	MC33274
Manufacturer	Multicomp
ChipWorker Part#	CW47471577
Category	Heatsinks, Heat Sink
Documentation	Datasheet
Mounting Style	Solder, Horizontal
Case/Package	TO-218
Thermal Resistance	5.9 ℃/W
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Size-Length	25.4 mm
Size-Width	35 mm
Size-Height	50 mm
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/12/17

Product Description

The MC33274 is a 50 x 35 x 25.6mm compact high power dissipation vertical mounting extruded Heat Sink with solderable fixing pins. This heat sink can be mounted through mounting holes and is suitable for use with a single TO2-18 TO-220 and TO 247 devices via clip.

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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