MC33FS6502LAE - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

MC33FS6502LAE
Manufacturer

NXP
ChipWorker Part#

CW157316711
Category

DC to DC Converter
Package

LQFP-EP-48
Description

BL Advanced Automotive Analog / System Basis Chip, DC-DC 0.8A Vcore LDT CAN LIN, LQFP48EP
Documentation

Datasheet

MC33FS6502LAE Global Supplier

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MC33FS6502LAE Specifications

Attribute	Attribute Value

Part Number	MC33FS6502LAE
Manufacturer	NXP
ChipWorker Part#	CW157316711
Category	DC to DC Converter
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	48 Pin
Case/Package	LQFP-EP-48
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
	expand all
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

Overview
The NXP® FS6500 system basis chip (SBC) provides power to MCUs and optimizes energy consumption through DC/DC switching regulators, linear regulators and ultra-low-power saving modes. Featuring:
* Advanced functional safety measures
* A serial peripheral interface (SPI) to allow control and diagnostics with the MCU
* Integration of CAN FD and LIN physical interfaces compliant with the ISO 11898-2,-5, LIN 2.2, 2.1/J2602-2 standards along with the latest automotive OEM standards for EMC and ESD
* A range of integrated safety features such as monitoring of critical analog parameters, a failsafe state machine and an advanced watchdog reduce software complexity with dual-core lock-step MCUs
MoreLess
## Features
* Power Management Unit
* Functional Safety Measures
* 2x Fail Safe outputs
* CAN FD 2Mbit/s and LIN robust physical layers
* Long Duration Timer
## Features

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- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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