MJD2955T4G - ON Semiconductor

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

MJD2955T4G
Manufacturer

ON Semiconductor
ChipWorker Part#

CW15600377
Category

BJT Transistor, BJT
Package

TO-252-3
Description

DPAK PNP 60V 10A
Documentation

Datasheet

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MJD2955T4G Specifications

Attribute	Attribute Value

Part Number	MJD2955T4G
Manufacturer	ON Semiconductor
ChipWorker Part#	CW15600377
Category	BJT Transistor, BJT
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	3 Pin
Case/Package	TO-252-3
Frequency	2 MHz
Voltage Rating (DC)	-60.0 V
Current Rating	-10.0 A
Number of Positions	3 Position
Polarity	N-Channel, P-Channel
Power Dissipation	1.75 W
Breakdown Voltage (Collector to Emitter)	60 V
Continuous Collector Current	10A
hFE Min	20 @4A, 4V
Input Power (Max)	1.75 W
DC Current Gain (hFE)	5
Operating Temperature (Max)	150 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	1750 mW
	expand all
Size-Length	6.73 mm
Size-Width	6.22 mm
Size-Height	2.38 mm
Material	Silicon
Operating Temperature	-55℃ ~ 150℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/12/17
ECCN Code	EAR99

Product Description

MJD2955 (PNP)
MJD3055 (NPN)
SILICON POWER TRANSISTORS 10 AMPERES 60 VOLTS, 20 WATTS
DPAK For Surface Mount Applications
Designed for general purpose amplifier and low speed switching applications.
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix)
• Straight Lead Version in Plastic Sleeves (“−1” Suffix)
• Electrically Similar to MJE2955 and MJE3055
• DC Current Gain Specified to 10 Amperes
• High Current Gain−Bandwidth Product − fT = 2.0 MHz (Min) @ IC= 500 mAdc
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B 8000 V
Machine Model, C 400 V
• Pb−Free Packages are Available

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
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- Anti-vibration foam
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- Electrical testing
- Surface testing

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