OMAP3503DCUS - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

OMAP3503DCUS
Manufacturer

TI
ChipWorker Part#

CW94947813
Category

Microprocessor IC
Package

FCBGA-423
Description

TEXAS INSTRUMENTS OMAP3503DCUS Applications Processor, 600MHz, 32Bit, 288KB, 0.985V to 1.35V, BGA-423
Documentation

Datasheet

OMAP3503DCUS Global Supplier

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OMAP3503DCUS Specifications

Attribute	Attribute Value

Part Number	OMAP3503DCUS
Manufacturer	TI
ChipWorker Part#	CW94947813
Category	Microprocessor IC
Documentation	Datasheet
Number of Pins	423 Pin
Case/Package	FCBGA-423
Supply Voltage (DC)	985mV (min)
Clock Speed	600 MHz
RAM Memory Size	64 KB
Number of Bits	32 Bit
Number of UARTs	3 UART
Operating Temperature (Max)	90 ℃
Operating Temperature (Min)	0 ℃
Supply Voltage (Max)	1.35 V
Supply Voltage (Min)	0.985 V
	expand all
Operating Temperature	0℃ ~ 90℃ (TJ)
Product Lifecycle Status	Obsolete
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/06/15
HK STC License	NLR

Product Description

Description
OMAP3515 and OMAP3503 devices are based on the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
• Streaming video
• Video conferencing
• High-resolution still image
The device supports high-level operating systems (HLOSs), such as:
• Linux®
• Windows® CE
• Android™
This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.
The following subsystems are part of the device:
• Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
• PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3515 device only)
• Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
• Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
• Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals
The device also offers:
• A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
• Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC
packages only)

expand all

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
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- Electrical testing
- Surface testing

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