OMAPL138EZWTD4 - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

OMAPL138EZWTD4
Manufacturer

TI
ChipWorker Part#

CW3556711
Category

Microprocessor IC
Package

LFBGA-361
Description

DSP Fixed-Point/Floating-Point 32Bit 456MHz 3648MIPS 361Pin NFBGA
Documentation

Datasheet

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OMAPL138EZWTD4 Specifications

Attribute	Attribute Value

Part Number	OMAPL138EZWTD4
Manufacturer	TI
ChipWorker Part#	CW3556711
Category	Microprocessor IC
Documentation	Datasheet
Number of Pins	361 Pin
Case/Package	LFBGA-361
Supply Voltage (DC)	1.25V (min)
Number of Positions	361 Position
Clock Speed	456 MHz
RAM Memory Size	8 KB
Number of UARTs	3 UART
Operating Temperature (Max)	90 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	1.35 V
Supply Voltage (Min)	1.25 V
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Size-Width	13 mm
Operating Temperature	-40℃ ~ 90℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	3A991.a.2

Product Description

Description
The OMAP-L138 C6000 DSP+ARM processor is a low-power applications processor based on an ARM926EJ-S and a C674x DSP core. This processor provides significantly lower power than other members of the TMS320C6000™ platform of DSPs.
OMAP-L138 C6000 DSP+ARM Processor
Features
• Dual-Core SoC
– 375- and 456-MHz ARM926EJ-S™ RISC MPU
– 375- and 456-MHz C674x Fixed- and Floating Point VLIW DSP
• ARM926EJ-S Core
– 32- and 16-Bit ( Thumb®) Instructions
– DSP Instruction Extensions
– Single-Cycle MAC
– ARM Jazelle® Technology
– Embedded ICE-RT™ for Real-Time Debug
• ARM9™ Memory Architecture
– 16KB of Instruction Cache
– 16KB of Data Cache
– 8KB of RAM (Vector Table)
– 64KB of ROM
• C674x Instruction Set Features
– Superset of the C67x+ and C64x+ ISAs
– Up to 3648 MIPS and 2746 MFLOPS
– Byte-Addressable (8-, 16-, 32-, and 64-Bit Data)
– 8-Bit Overflow Protection
– Bit-Field Extract, Set, Clear
– Normalization, Saturation, Bit-Counting
– Compact 16-Bit Instructions
• C674x Two-Level Cache Memory Architecture
– 32KB of L1P Program RAM/Cache
– 32KB of L1D Data RAM/Cache
– 256KB of L2 Unified Mapped RAM/Cache
– Flexible RAM/Cache Partition (L1 and L2)
• Enhanced Direct Memory Access Controller 3(EDMA3):
– 2 Channel Controllers
– 3 Transfer Controllers
– 64 Independent DMA Channels
– 16 Quick DMA Channels
– Programmable Transfer Burst Size
• TMS320C674x Floating-Point VLIW DSP Core
– Load-Store Architecture with Nonaligned Support
– 64 General-Purpose Registers (32-Bit)
– Six ALU (32- and 40-Bit) Functional Units
• Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
• Supports up to Four SP Additions Per Clock, Four DP Additions Every Two Clocks
• Supports up to Two Floating-Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
– Two Multiply Functional Units:
• Mixed-Precision IEEE Floating-Point Multiply Supported up to:
– 2 SP x SP → SP Per Clock
– 2 SP x SP → DP Every Two Clocks
– 2 SP x DP → DP Every Three Clocks
– 2 DP x DP → DP Every Four Clocks
• Fixed-Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
– Instruction Packing Reduces Code Size
– All Instructions Conditional
– Hardware Support for Modulo Loop Operation
– Protected Mode Operation
– Exceptions Support for Error Detection and Program Redirection
Software Support
– TI DSP BIOS™
– Chip Support Library and DSP Library
128KB of RAM Shared Memory
1.8-V or 3.3-V LVCMOS I/Os (Except for USB and DDR2 Interfaces)
Two External Memory Interfaces:
– EMIFA
• NOR (8- or 16-Bit-Wide Data)
• NAND (8- or 16-Bit-Wide Data)
• 16-Bit SDRAM with 128-MB Address Space
– DDR2/Mobile DDR Memory Controller with one of the following:
• 16-Bit DDR2 SDRAM with 256-MB Address Space
Applications
• Professional or Private Mobile Radio (PMR)
• Remote Radio Unit (RRU)
• Remote Radio Head (RRH)
• Industrial Automation
• Currency Inspection
• Biometric Identification
• Machine Vision (Low-End)
• Smart Grid Substation Protection
• Industrial Portable Navigation Devices

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- Vacuum packed
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