R5F211B2SP - Renesas Electronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

R5F211B2SP
Manufacturer

Renesas Electronics
ChipWorker Part#

CW387900637
Package

LSSOP
Description

MCU 16Bit R8C CISC 8KB Flash 3.3V/5V 20Pin LSSOP
Documentation

Datasheet

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R5F211B2SP Specifications

Attribute	Attribute Value

Part Number	R5F211B2SP
Manufacturer	Renesas Electronics
ChipWorker Part#	CW387900637
Documentation	Datasheet
Number of Pins	20 Pin
Case/Package	LSSOP
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Product Lifecycle Status	Active
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

Overview
These MCUs are fabricated using the high-performance silicon gate CMOS process, embedding the R8C/ Tiny Series CPU core, and is packaged in a 20-pin molded-plastic LSSOP, SDIP or a 28-pin plastic molded-HWQFN. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/1B Group has on-chip data flash ROM (1 KB × 2 blocks). The difference between the R8C/1A Group and R8C/1B Group is only the presence or absence of data flash ROM. Their peripheral functions are the same.

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