S912ZVLA12F0MLC - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

S912ZVLA12F0MLC
Manufacturer

NXP
ChipWorker Part#

CW103293133
Category

Microcontroller, MCU IC
Package

LQFP-32
Description

MagniV 16Bit MCU, S12Z core, 128KB Flash, 32MHz, -40/+125℃, Automotive Qualified, QFP 32
Documentation

Datasheet

S912ZVLA12F0MLC Global Supplier

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S912ZVLA12F0MLC Specifications

Attribute	Attribute Value

Part Number	S912ZVLA12F0MLC
Manufacturer	NXP
ChipWorker Part#	CW103293133
Category	Microcontroller, MCU IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	32 Pin
Case/Package	LQFP-32
Number of Positions	32 Position
RAM Memory Size	8 KB
Number of ADCs	1 ADC
Number of Inputs and Outputs	19 Input IO
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	18 V
Supply Voltage (Min)	5.5 V
	expand all
Operating Temperature	-40℃ ~ 125℃ (TA)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status

Product Description

Overview
The S12ZVL platform, part of the S12 MagniV mixed-signal MCU product line, offers a low-cost, highly integrated solution for space-constrained automotive LIN nodes. With memory sizes from 8-128K flash, the family provides scalability for platform standardization.
The S12ZVL integrates a sophisticated S12Z core with a 12 V to 5 V voltage regulator and a LIN physical layer transceiver for automotive and industrial applications such as sensor interfaces, actuators, switch panels or ambient lighting.
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## Features
* S12Z core - 32 MHz bus speed
* Up to 128 KB Flash (with ECC)
* Up to 2KB EEPROM (with ECC)
* Up to 8 KB RAM (with ECC)
* Analog comparator and DAC
* PGA
* 12V Vreg to supply device + ext comp- 70mA total (170mA with ext. Ballast)
* LIN physical layer
* On-chip RC-oscillator trimmed to 1.3% accuracy, no ext xtal required on LIN
* Ultra-Reliable MCUs
## Features

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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