S912ZVML12F3WKH - NXP

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

S912ZVML12F3WKH
Manufacturer

NXP
ChipWorker Part#

CW235341030
RoHS

Lead free / RoHS Compliant
Description

MCU 16Bit S12Z CISC 128KB Flash 5V 64Pin HLQFP EP Tray
Documentation

Datasheet

S912ZVML12F3WKH Global Supplier

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S912ZVML12F3WKH Specifications

Attribute	Attribute Value

Part Number	S912ZVML12F3WKH
Manufacturer	NXP
ChipWorker Part#	CW235341030
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	64 Pin
Case/Package	LQFP-64
Number of Positions	64 Position
RAM Memory Size	8 KB
Number of ADCs	2 ADC
Number of Inputs and Outputs	24 Input IO
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	4.5 V
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Operating Temperature	-40℃ ~ 150℃ (TA)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status	Lead Free

Product Description

S12Z S12 MagniV Microcontroller IC 16-Bit 50MHz 128KB (128K x 8) FLASH 64-LQFP (10x10)

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Ordering Information

Order Payment Shipping Package Quality Assurance

These terms and conditions are for reference only. The actual terms and conditions are subject to the sales staff's quotation.
- Please check the technical specifications of the products when ordering.
- MOQ is the minimum order quantity required to purchase each part.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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