SN74ABT540DBR - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

SN74ABT540DBR
Manufacturer

TI
ChipWorker Part#

CW9292536
Category

Logic Control, Logic Gate IC
Package

SSOP-20
Description

Buffer/Line Driver 8CH Inverting 3-ST BiCMOS 20Pin SSOP T/R
Documentation

Datasheet

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SN74ABT540DBR Specifications

Attribute	Attribute Value

Part Number	SN74ABT540DBR
Manufacturer	TI
ChipWorker Part#	CW9292536
Category	Logic Control, Logic Gate IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	20 Pin
Case/Package	SSOP-20
Supply Voltage (DC)	4.50V ~ 5.50V
Number of Outputs	8 Output
Number of Circuits	1 Circuit
Number of Channels	8 Channel
Number of Bits	8 Bit
Propagation Delay Max (tpd)	4.80 ns
Voltage Nodes	5.00 V
Quiescent Current	24 mA
Output Current Drive	-500 µA
Number of Inputs	8 Input
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	4.5V ~ 5.5V
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	4.5 V
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Size-Length	7.2 mm
Size-Width	5.3 mm
Size-Height	1.95 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	EAR99

Product Description

description
The ’ABT540 octal buffers and line drivers are ideal for driving bus lines or buffer memory address registers. The devices feature inputs and outputs on opposite sides of the package that facilitate printed circuit board layout.
The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2) input is high, all corresponding outputs are in the high-impedance state.
• State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation
• ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• High-Drive Outputs (–32-mA IOH, 64-mA IOL)
• Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package

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