SN74ABT541BPW - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

SN74ABT541BPW
Manufacturer

TI
ChipWorker Part#

CW12562936
Category

Logic Control, Logic Gate IC
Package

TSSOP-20
Description

Buffer/Line Driver 8CH Non-Inverting 3-ST BiCMOS 20Pin TSSOP Tube
Documentation

Datasheet

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SN74ABT541BPW Specifications

Attribute	Attribute Value

Part Number	SN74ABT541BPW
Manufacturer	TI
ChipWorker Part#	CW12562936
Category	Logic Control, Logic Gate IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	20 Pin
Case/Package	TSSOP-20
Supply Voltage (DC)	4.50V ~ 5.50V
Number of Outputs	8 Output
Number of Channels	8 Channel
Number of Positions	20 Position
Number of Bits	8 Bit
Propagation Delay Max (tpd)	3.90 ns
Voltage Nodes	5.00 V
Quiescent Current	22 mA
Output Current Drive	-500 µA
Number of Inputs	8 Input
Operating Temperature (Max)	85 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	4.5V ~ 5.5V
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	4.5 V
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Size-Length	6.5 mm
Size-Width	4.4 mm
Size-Height	1.15 mm
Operating Temperature	-40℃ ~ 85℃
Product Lifecycle Status	Active
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	EAR99

Product Description

DESCRIPTION/ORDERING INFORMATION
The SN54ABT541 and SN74ABT541B octal buffers and line drivers are ideal for driving bus lines or buffering memory address registers. The devices feature inputs and outputs on opposite sides of the package to facilitate printed circuit board layout.
FEATURES
• State-of-the-Art EPIC-IIB™ BiCMOS Design
Significantly Reduces Power Dissipation
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
• High-Impedance State During Power Up and Power Down
• High-Drive Outputs (–32-mA IOH, 64-mA IOL) • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (N) and Ceramic (J) DIPs

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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