SN74AS760N - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

SN74AS760N
Manufacturer

TI
ChipWorker Part#

CW15424200
Category

Logic Controller, Logic IC
Package

PDIP-20
Description

TEXAS INSTRUMENTS SN74AS760N Buffer / Driver, 4.5V to 5.5V, DIP-20
Documentation

Datasheet

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SN74AS760N Specifications

Attribute	Attribute Value

Part Number	SN74AS760N
Manufacturer	TI
ChipWorker Part#	CW15424200
Category	Logic Controller, Logic IC
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	20 Pin
Case/Package	PDIP-20
Digital Logic Level	TTL
Supply Voltage (DC)	4.50V ~ 5.50V
Number of Outputs	8 Output
Supply Current	100 µA
Number of Channels	8 Channel
Number of Bits	8 Bit
Propagation Delay Max (tpd)	18.5 ns
Voltage Nodes	5.00 V
Number of Inputs	8 Input
Operating Temperature (Max)	70 ℃
Operating Temperature (Min)	0 ℃
Supply Voltage	4.5V ~ 5.5V
Supply Voltage (Max)	5.5 V
Supply Voltage (Min)	4.5 V
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Operating Temperature	0℃ ~ 70℃
Product Lifecycle Status	Active
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	EAR99

Product Description

description
These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters by eliminating the need for 3-state overlap protection. With the ′AS756 and SN74AS757, these devices provide the choice of selected combinations of inverting outputs, symmetrical active-low output-enable (OE) inputs, and complementary OE and OE inputs.
The SN54AS760 is characterized for operation over the full military temperature range of −55°C to 125°C. The SN74ALS760 and SN74AS760 are characterized for operation from 0°C to 70°C.
• Open-Collector Outputs Drive Bus Lines or Buffer Memory Address Registers
• Eliminates the Need for 3-State Overlap Protection
• pnp Inputs Reduce dc Loading
• Open-Collector Versions of ′ALS244 and ′AS244
• Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-mil DIPs

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