SN74LVC2G04YZPR - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

SN74LVC2G04YZPR
Manufacturer

TI
ChipWorker Part#

CW42268634
Category

Logic Control, Logic Gate IC
Package

DSBGA-6
Description

Inverter 2Element CMOS 6Pin DSBGA T/R
Documentation

Datasheet

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SN74LVC2G04YZPR Specifications

Attribute	Attribute Value

Part Number	SN74LVC2G04YZPR
Manufacturer	TI
ChipWorker Part#	CW42268634
Category	Logic Control, Logic Gate IC
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	6 Pin
Case/Package	DSBGA-6
Number of Circuits	2 Circuit
Number of Bits	2 Bit
Propagation Delay Max (tpd)	3.20 ns
Number of Gates	2 Gate
Number of Inputs	2 Input
Operating Temperature (Max)	125 ℃
Operating Temperature (Min)	-40 ℃
Supply Voltage	1.65V ~ 5.5V
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Size-Height	0.31 mm
Operating Temperature	-40℃ ~ 125℃
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	EAR99

Product Description

Description
This dual inverter is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G04 device performs the Boolean function Y = A.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
Features
• Available in the Texas Instruments NanoFree™ Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 4.1 ns at 3.3 V
• Low Power Consumption, 10-μA Max ICC
• ±24-mA Output Drive at 3.3 V
• Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
• Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
Applications
• IP Phones: Wired and Wireless
• Optical Modules
• Optical Networking: EPON and Video Over Fiber
• Point-to-Point Microwave Backhaul
• Power: Telecom DC/DC Module: Analog and Digital
• Private Branch Exchanges (PBX)
• TETRA Base Exchanges
• Telecom Base Band Units
• Telecom Shelters: Power Distribution Units (PDU), Power Monitoring Units (PMU), Wireless Battery Monitoring, Remote Electrical Tilt Units (RET), Remote Radio Units (RRU), Tower Mounted

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- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
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- Electrical testing
- Surface testing

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