SN75462P - TI

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

SN75462P
Manufacturer

TI
ChipWorker Part#

CW39544793
Category

Interface IC, Interface Controller
Package

DIP-8
Description

Pref DRVR Dual 4.75V to 5.25V 1000mW 8Pin PDIP Tube
Documentation

Datasheet

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SN75462P Specifications

Attribute	Attribute Value

Part Number	SN75462P
Manufacturer	TI
ChipWorker Part#	CW39544793
Category	Interface IC, Interface Controller
Documentation	Datasheet
Mounting Style	Through Hole
Number of Pins	8 Pin
Case/Package	DIP-8
Supply Voltage (DC)	4.75V (min)
Number of Outputs	2 Output
Output Voltage	35 V
Output Current	400 mA
Supply Current	76 mA
Power Dissipation	1 W
Drivers Per Package	2
Input Voltage (Max)	5.5 V
Operating Temperature (Max)	70 ℃
Operating Temperature (Min)	0 ℃
Power Dissipation (Max)	1000 mW
Supply Voltage	4.75V ~ 5.25V
Supply Voltage (Max)	5.25 V
Supply Voltage (Min)	4.75 V
Input Voltage	5.5 V
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Operating Temperature	0℃ ~ 70℃
Product Lifecycle Status	Active
Packaging	Tube
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
REACH SVHC Compliance	No SVHC
REACH SVHC Compliance Edition	2015/06/15
ECCN Code	EAR99

Product Description

description
These dual peripheral drivers are functionally interchangeable with SN55451B through SN55453B and SN75451B through SN75453B peripheral drivers, but are designed for use in systems that require higher breakdown voltages than those devices can provide at the expense of slightly slower switching speeds. Typical applications include logic buffers, power drivers, relay drivers, lamp drivers, MOS drivers, line drivers, and memory drivers.
PERIPHERAL DRIVERS FOR HIGH-VOLTAGE, HIGH-CURRENT DRIVER APPLICATIONS
• Characterized for Use to 300 mA
• High-Voltage Outputs
• No Output Latch-Up at 30 V (After Conducting 300 mA)
• Medium-Speed Switching
• Circuit Flexibility for Varied Applications and Choice of Logic Function
• TTL-Compatible Diode-Clamped Inputs
• Standard Supply Voltages
• Plastic DIP (P) With Copper Lead Frame for Cooler Operation and Improved Reliability
• Package Options Include Plastic Small Outline Packages, Ceramic Chip Carriers, and Standard Plastic and Ceramic 300-mil DIPs

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