STGD6M65DF2 - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

STGD6M65DF2
Manufacturer

ST Microelectronics
ChipWorker Part#

CW52257193
Package

TO-252-3
Description

Trans IGBT Chip N-CH 650V 12A 88000mW 3Pin(2+Tab) DPAK T/R
Documentation

Datasheet

STGD6M65DF2 Global Supplier

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STGD6M65DF2 Specifications

Attribute	Attribute Value

Part Number	STGD6M65DF2
Manufacturer	ST Microelectronics
ChipWorker Part#	CW52257193
Documentation	Datasheet
Mounting Style	Surface Mount
Number of Pins	3 Pin
Case/Package	TO-252-3
Power Dissipation	88000 mW
Breakdown Voltage (Collector to Emitter)	650 V
Reverse recovery time	140 ns
Input Power (Max)	88 W
Operating Temperature (Max)	175 ℃
Operating Temperature (Min)	-55 ℃
Power Dissipation (Max)	88000 mW
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Operating Temperature	-55℃ ~ 175℃ (TJ)
Product Lifecycle Status	Active
Packaging	Tape & Reel (TR)
RoHS	RoHS Compliant
Lead-Free Status	Lead Free
ECCN Code	EAR99

Product Description

IGBT Trench Field Stop 650V 12A 88W Surface Mount DPAK

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Ordering Information

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- Please check the technical specifications of the products when ordering.
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- If you need a detailed invoice or a tax identifier, please contact us.
- Delivery will take between 1 to 2 weeks after the shipment is sent to your country.
- Your order will be processed only after the invoice has been paid.
- The tracking number will be sent to you after the order is shipped. (It may take up to 24 hours for the information to be available from the carrier.) View more >
- Carefully tested and packaged by ChipWorker
- Vacuum packed
- Anti-static packaging
- Anti-vibration foam
- Income quality control (IQC), 800+ qualified distributors.
- Authorities test the chip to ensure the quality, authenticity and safety of your device.
- Decapsulation control
- X-ray inspection
- XRF inspection
- Electrical testing
- Surface testing

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