STM32F429NIH7 - ST Microelectronics

The pictures are for reference only, and the specific specifications can be found in the product manual.

Part No

STM32F429NIH7
Manufacturer

ST Microelectronics
ChipWorker Part#

CW93949766
Category

Microcontroller, MCU IC
Package

TFBGA-216
Description

MCU 32Bit STM32 ARM Cortex M4 RISC 2048KB Flash 2.5V/3.3V 216Pin TFBGA
Documentation

Datasheet

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STM32F429NIH7 Specifications

Attribute	Attribute Value

Part Number	STM32F429NIH7
Manufacturer	ST Microelectronics
ChipWorker Part#	CW93949766
Category	Microcontroller, MCU IC
Documentation	Datasheet
Number of Pins	216 Pin
Case/Package	TFBGA-216
RAM Memory Size	260 KB
Power Dissipation	690 mW
Number of ADCs	3 ADC
Operating Temperature (Max)	105 ℃
Operating Temperature (Min)	-40 ℃
Power Dissipation (Max)	690 mW
Number of DACs	1 DAC
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Operating Temperature	-40℃ ~ 105℃ (TA)
Product Lifecycle Status	Active
Packaging	Tray
RoHS	RoHS Compliant
Lead-Free Status

Product Description

* Core: ARM® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 180 MHz, MPU, 225 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions * Memories * Up to 2 MB of Flash memory organized into two banks allowing read-while-write * Up to 256+4 KB of SRAM including 64-KB of CCM (core coupled memory) data RAM * Flexible external memory controller with up to 32-bit data bus: SRAM,PSRAM,SDRAM/LPSDR SDRAM , Compact Flash/NOR/NAND memories * LCD parallel interface, 8080/6800 modes * LCD-TFT controller up to XGA resolution with dedicated Chrom-ART Accelerator™ for enhanced graphic content creation (DMA2D) * Clock, reset and supply management * 1.7 V to 3.6 V application supply and I/Os * POR, PDR, PVD and BOR * 4-to-26 MHz crystal oscillator * Internal 16 MHz factory-trimmed RC (1% accuracy) * 32 kHz oscillator for RTC with calibration * Internal 32 kHz RC with calibration * Sleep, Stop and Standby modes * VBATsupply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM * 3×12-bit, 2.4 MSPS ADC: up to 24 channels and 7.2 MSPS in triple interleaved mode * 2×12-bit D/A converters * General-purpose DMA: 16-stream DMA controller with FIFOs and burst support * Up to 17 timers: up to twelve 16-bit and two 32-bit timers up to 180 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input * Debug mode * SWD & JTAG interfaces * Cortex-M4 Trace Macrocell™ * Up to 168 I/O ports with interrupt capability * Up to 164 fast I/Os up to 90 MHz * Up to 166 5 V-tolerant I/Os * Up to 21 communication interfaces * Up to 3 × I²C interfaces (SMBus/PMBus) * Up to 4 USARTs/4 UARTs (11.25 Mbit/s, ISO7816 interface, LIN, IrDA, modem control) * Up to 6 SPIs (45 Mbits/s), 2 with muxed full-duplex I²S for audio class accuracy via internal audio PLL or external clock * 1 x SAI (serial audio interface) * 2 × CAN (2.0B Active) and SDIO interface * Advanced connectivity * USB 2.0 full-speed device/host/OTG controller with on-chip PHY * USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI * 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII * 8- to 14-bit parallel camera interface up to 54 Mbytes/s * True random number generator * CRC calculation unit * RTC: subsecond accuracy, hardware calendar * 96-bit unique ID

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